Intellectual Property Rights (IPR)

WLPoP TM - Nested Wafer-Level Chip Scale Packaging

Letters of patent, invention and technology licencing are based on the following IP reference:
US Patent No. 8304875 - GRANTED November 6th 2012

Taiwanese Patent No. I523168 - GRANTED November 23rd 2015

(Priority GB Application No: 0711676.7 16th June 2007)

CLAM-LP TM - QFN Innovation

invention and technology licencing is based on the following IP reference:
US Patent No. 7880282 - GRANTED February 1st 2011
(Priority GB Application No: 0329351.1 18th December 2003)

BeanIoT TM - IoT Edge-Node

invention and technology is based on the following IP reference:

PCT Patent Application No. PCT/GB2016/051054 - PENDING 15th April 2016
Based on GB Patent Application No. 1506499.1 - 16th April 2015

PUBLISHED: Int Pat App WO 2016/166547 - 20th October 2016

Design Registration (OHIM) : 002689125 & 002737502 - Priority 24th April 2015

Trademarks
RFMOD / WLPoP / CLAM-LP and BeanIoT are all established trademarks owned by RF Module & Optical Design Limited.

Other products, logos, and company names mentioned herein may be the trademarks or registered trademarks of their respective owners.

Disclaimer
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RFMOD makes no representation that materials on the site are appropriate or available for use in other locations and jurisdictions, and access to them from locations where their contents are illegal is prohibited. Those accessing this site from locations outside the United Kingdom do so on their own initiative and are responsible for complying with applicable local laws. Any claim relating to or concerning the materials on this site shall be governed by the laws of the United Kingdom.
 
Links to Outside Sites
RFMOD's Web site(s) www.rfmod.com and www.BeanIoT.com may contain links to outside sites. These links are provided as a courtesy to our consumers and in no way imply endorsement by RFMOD. RFMOD is in no way responsible for the content of any site linked to from the RFMOD Web site.