Intellectual Property Rights (IPR)
WLPoP TM - Nested Wafer-Level Chip Scale Packaging
Letters of patent, invention and technology licencing are based on the following IP reference:
US Patent No. 8304875 - GRANTED November 6th 2012
Taiwanese Patent No. I523168 - GRANTED November 23rd 2015
(Priority GB Application No: 0711676.7 16th June 2007)
CLAM-LP TM - QFN Innovation
invention and technology licencing is based on the following IP reference:
US Patent No. 7880282 - GRANTED February 1st 2011
(Priority GB Application No: 0329351.1 18th December 2003)
BeanIoT TM - IoT Edge-Node
invention and technology is based on the following IP reference:
PCT Patent Application No. PCT/GB2016/051054 - PENDING 15th April 2016
Based on GB Patent Application No. 1506499.1 - 16th April 2015
PUBLISHED: Int Pat App WO 2016/166547 - 20th October 2016
Design Registration (OHIM) : 002689125 & 002737502 - Priority 24th April 2015
RFMOD / WLPoP / CLAM-LP and BeanIoT are all established trademarks owned by RF Module & Optical Design Limited.
Other products, logos, and company names mentioned herein may be the trademarks or registered trademarks of their respective owners.
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