RFMOD is offering its proprietary semiconductor packaging technolgies enabling the delivery of disruptive products of unprecedented functionality, performance, value and size.
RFMOD uniquely leverages best practice in co-design to potently combine 3rd party SoC's into SiP modules targeting high volume, size /cost critical markets such as mobile phones.
Design-for-market and manufacturing knowledge is aligned to provide optimised solutions characterised by clearly targeted performance, reduced Bill-of-Materials (BoM), simplified PCB and SMT assembly. Customers directly benefit from a simplified build and lowest cost-of-ownership.
CLAM-LPTM and WLPoPTM technologies are uniquely designed to solve the many of the key issues faced by mobile phone designers and their semiconductor suppliers. Both technologies use existing manufacturing techiques, equipment and materials ensuring a low-barrier to adoption.
RFMOD technologies are offered through our licensed partner programme.
CLAM-LP TM
WLPoP TM